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Huawei Banks on Chip Packaging Innovation – SCMP

Industry analysts described the innovation as a potential way to ease the disruptions caused by US chip sanctions on the firm’s operations

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Huawei intellectual property
Chinese courts have repeatedly issued “anti-suit injunctions” on behalf of smartphone groups such as Huawei. File photo: Reuters.


Chinese telecommunications giant Huawei Technologies has filed a patent application on the mainland for a semiconductor packaging innovation, which industry analysts describe as a potential way to ease the disruptions caused by US chip sanctions on the firm’s operations, the South China Morning Post reported.

The company’s patent application for “a type of chip stacking package and terminal device” is expected to help “solve the problem of high costs due to the use of through-chip … while ensuring power supply requirements”, according to a statement released on Tuesday by the China National Intellectual Property Administration.

Read the full report: South China Morning Post



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George Russell

George Russell is a freelance writer and editor based in Hong Kong who has lived in Asia since 1996. His work has been published in the Financial Times, The Wall Street Journal, Bloomberg, New York Post, Variety, Forbes and the South China Morning Post.


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