China Chipmaker Hua Hong to Build $6.7bn Wafer Fab – Yicai

An engineer holds a chip he was testing at the Taiwan Semiconductor Research Institute in Hsinchu. Photo: Reuters.

China’s Hua Hong Semiconductor has announced plans to build a state-backed $6.7-billion chip fab, in a joint venture with a “municipal entity” from China’s Wuxi city, Yicai Global reported.

The second-largest chipmaker in China after SMIC, Hua Hong will produce 300mm (12-inch) semiconductor wafers at the factory. They are widely used to make power and memory chips.

Read the full report: Yicai Global.

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Vishakha Saxena

Vishakha Saxena is the Multimedia and Social Media Editor at Asia Financial. She has been working as a digital journalist since 2013, and is an experienced writer and multimedia producer. As an eager stock market trader and investor, she is keenly interested in economy, emerging markets and the intersections of finance and society. You can tweet to her @saxenavishakha